Novellus Advances PVD TaN Barrier Film

TOP STORY... May 28, 2009

Novellus said its has developed a conformal hollow cathode magnetron (HCM) PVD technology, called IONX XL, which provides the very thin barrier layers needed for the copper interconnects at the 3X node. The barrier film challenge is causing some companies to consider a shift from planar PVD to the more expensive CVD approach, but Novellus said it can extend PVD to the 3X generation. 
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