TOP STORY... April 8, 2009
Cleaning leading-edge copper interconnect layers has become a major challenge, particularly as cobalt-based via capping layers are introduced. At the Sematech Surface Preparation and Cleaning Conference (SPCC), researchers from several companies presented new BEOL cleaning techniques that are tolerated by 32 nm copper interconnects and CoWP-based caps.
Read more >>
Cleaning leading-edge copper interconnect layers has become a major challenge, particularly as cobalt-based via capping layers are introduced. At the Sematech Surface Preparation and Cleaning Conference (SPCC), researchers from several companies presented new BEOL cleaning techniques that are tolerated by 32 nm copper interconnects and CoWP-based caps. Read more >>
