Flip-Chip Packaging Becomes Competitive

TOP STORY... May 19, 2009

Flip-chip packaging is gradually replacing the once-dominant wire-bonded technology in products ranging from digital cameras to servers, writes Contributing Editor Sally Cole Johnson in the May issue of Semiconductor International. Flip-chip's appeal is increasing as its cost competitiveness with wire bonding improves in the 200–700 pin count range. The primary technical benefits include size savings, shorter path lengths with low inductance, high I/O density, rework capability, self-alignment and superior thermal management.
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