Downturn to Spur Shift to 3-D Packaging

TOP STORY... May 27, 2009

The past several semiconductor downturns have resulted in transitions from one generation of packaging to the next. This one's no exception. "Out of this downturn, we're rapidly shifting from 2-D to 
3-D packaging," says Jim Walker, vice president of semiconductor manufacturing research at Gartner Inc. 
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