Infrastructure Still Inhibits 3-D ICs

TOP STORY... May 20, 2009

Contributing Editor Ruth DeJule examines the status of 3-D technologies, including obstacles that may be slowing down the commercialization process. "The industry is debating between wafer-to-wafer and die-to-wafer stacking, with the process requirements of high assembly yield, and low complexity and cost," DeJule writes. "The choice will be determined based on application and economic grounds." 
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