TOP STORY... May 20, 2009
Contributing Editor Ruth DeJule examines the status of 3-D technologies, including obstacles that may be slowing down the commercialization process. "The industry is debating between wafer-to-wafer and die-to-wafer stacking, with the process requirements of high assembly yield, and low complexity and cost," DeJule writes. "The choice will be determined based on application and economic grounds."
Read more >>
Thursday, May 21, 2009
Infrastructure Still Inhibits 3-D ICs
0 comments:
Post a Comment