TOP STORY... May 4, 2009
Researchers at the International Interconnect Technology Conference (IITC), planned for June 1-3 in Sapporo, Japan, will present new metallization and processing schemes for contacts, barrier layers, wetting agents and copper silicides. The Sapporo IITC meeting will feature studies of copper contacts, ruthenium nitride barriers and CVD ruthenium wetting agents, among others.
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Tuesday, May 5, 2009
2009 IITC to Consider Metals for 22 nm
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