from Semiconductor International
Packaging expert Phil Garrou offers 3-D packaging updates from the TechXPOT stages of SEMICON West. He offers his take on the latest from Dow Electronic Materials, Semitool, STATS ChipPAC and IMEC. more » » »
Tuesday, August 25, 2009
Perspectives From the Leading Edge: SEMICON TechXPOTs
Packaging expert Phil Garrou offers 3-D packaging updates from the TechXPOT stages of SEMICON West. He offers his take on the latest from Dow Electronic Materials, Semitool, STATS ChipPAC and IMEC. more » » »
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