FSI Adds Steam to Photoresist Clean Step

TOP STORY... March 26, 2009

FSI International has developed an all-wet cleaning process that preserves ultrashallow junctions while cleaning carbonized photoresists. Speaking at the Sematech Surface Preparation and Cleaning Conference, FSI chief technologist Jeff Butterbaugh said the photoresist stripping technique injects steam into a sulfuric peroxide mixture. "We see a significant improvement to the photoresist stripping capability by adding steam to the process," he said.
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Posted in: materials engineering,Photoresist Clean Step