Sunday, December 6, 2009

Researchers Strive for Copper TSV Reliability

2:50 PM  Materials Community  1 comment

from SemiConductor International
TSV TS (120309CuTSV330.jpg)

Moving 3-D TSVs to high-volume manufacturing will require rock-stable TSV reliability. Although copper CTE-related issues have appeared during recent scale-up activities, IMEC and other research centers are beginning to come up with solutions. more » » »  

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1 comments:

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