from Semiconductor International
Carsem, a provider of turnkey packaging and test services, announced an extremely thin version of its Micro Leadframe Package (MLP). more » » »
Thursday, November 5, 2009
Carsem Announces Extremely Thin MLP
Carsem, a provider of turnkey packaging and test services, announced an extremely thin version of its Micro Leadframe Package (MLP). more » » »
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