The 3400 series single-wafer cleaning processor from Solid State Equipment Corp. has been chosen by the International Sematech Manufacturing Initiative (ISMI) to clean particles and metallic contaminants from 450 mm silicon wafers. more » » » 
Post-Silicon Solutions Emerging
Researchers have an array of new technologies in the pipeline to boost CMOS logic and memory performance, Sematech Vice President Raj Jammy said Tuesday at the Device Scaling TechXPOT at SEMICON West. High-mobility graphene channels, gates built around nanowires, finFETs with III-V materials -- all promise to blow past the power/performance capabilities of silicon CMOS. more » » » 
IMEC Reveals Interconnect Roadmap to 10 nm
IMEC says there has been great progress in identifying metallization solution for 22 nm. The research center and its partners also have demonstrated interconnect feasibility to the 10 nm node, targeting the year 2022. more » » » 
ISMI Reports Progress at SEMICON West
At the SEMICON West show, ISMI met the supplier community to discuss progress with the 450 mm and Next Generation Factory programs. The 450 mm effort is moving from automation and wafer handling testing to demonstration wafer processing equipment. Updated metrics for 60 different types of equipment were posted to the ISMI website early today.more » » » 
SUSS MicroTec, 3M Partner on 3-D Bonds
SUSS MicroTec AG (Garching, Germany) and 3M Corp. (Minneapolis) will work together, offering 3M's temporary bonding process as part of the new SUSS 300 mm bonder line. more » » »
Saturday, July 18, 2009
News from Semiconductor International
ISMI Selects SSEC 450 mm Single Wafer Cleaner
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