IBM Readies 32 nm eDRAM With Low Latency

News from Semiconductor International

IBM unveiled a 32 nm SOI embedded DRAM, and will provide details at the upcoming IEDM in December. Gary Patton, vice president for IBM's SRDC, said the SOI eDRAM has latency and cycle times of less than 2 ns, uses 4 times less standby power, and has "up to a 1000 times lower soft-error rate (SER), better power savings, and reliability comparable to a similar SRAM." more » » » 

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Photovoltaics Report

from Semiconductor International

Solar Outlooks: Doom and Gloom, an Overreaction
In her latest blog, Navigant's Paula Mints reassures readers that, despite what will be a couple slow years ahead, the solar business will continue on its profitable path. more » » » 

Showa Shell to Convert Display Fab to Module Manufacturing
Japan-based oil company Showa Shell said it will convert a now-empty Hitachi plasma display factory to CIS module production, investing ~$1.1B to establish its third solar production facility. The converted plant is expected to begin operations in 2H 2011, with 900 MW worth of capacity, making it one of the largest PV fabs worldwide. more » » » 

First Solar Wins Major PV Order in China
In an announcement that is significant on several levels, U.S.-based First Solar Inc. announced a memorandum of understanding (MOU) for what is the world's biggest power plant project to date, to be built in China's Mongolian desert. more » » » 

Teenager Invents $38 Solar Panel Made With Human Hair
A new type of solar panel could provide the world with cheap, green electricity, believes its teenage inventor, Milan Karki, who comes from a village in rural Nepal. The young inventor says human hair is easy to use as a conductor in solar panels, and could revolutionize renewable energy, reports Britain's Daily Mail. more » » » 

PV Model Provides Local Clean Energy Blueprint
Applied Materials has developed a business model for solar deployment designed to bring cost-effective, utility-scale solar power generation capability to local areas while stimulating economic development. Baptized the fab2farm model, it represents a complete regional ecosystem. more » » » 

GT Solar Opens Asia Headquarters in China
U.S.-based solar equipment provider GT Solar has officially opened an Asia headquarters in Shanghai, China, to better serve a region where business has been growing for the past few years. more » » » 

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Molecular Imprints Takes Template Replication to HDD Production

from Semiconductor International

Molecular Imprints Inc. today introduced the Perfecta TR1100 template replication system to the hard disk drive industry, providing for significant reductions in the time and cost needed for high-density disk production. Mask and HDD maker Hoya has placed one of two orders received already.more » » » 

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China Racing Ahead of U.S. in the Drive to Go Solar

from Semiconductor International

President Obama wants to make the United States "the world's leading exporter of renewable energy," but in his seven months in office, it is China that has stepped on the gas in an effort to become the dominant player in green energy -- especially in solar power, and even in the United States. In this New York Times article, Keith Bradsher details what China is doing to get ahead in solar. more » » » 

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IC Insights: Conditions Favor Flash Density

from Semiconductor International

The flash memory market is setting up for a dramatic shift in the supply-demand balance -- one that will fuel growth for the NAND flash market through 2012. Bit growth is escalating wildly, yet this does not translate to great increases in capital spending. more » » » 

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Imaging Bonded Wafer Defects for 3-D

from Semiconductor International

The range of products whose fabrication depends on wafer-to-wafer bonding is growing rapidly, and includes MEMS, wafer-level packaging and various types of 3-D integration. A practical, acoustic imaging technique is applied to bonded wafer pairs to image interface defects and wafer scratches in various materials. more » » » 

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Perspectives From the Leading Edge: SEMICON TechXPOTs

from Semiconductor International

Packaging expert Phil Garrou offers 3-D packaging updates from the TechXPOT stages of SEMICON West. He offers his take on the latest from Dow Electronic Materials, Semitool, STATS ChipPAC and IMEC. more » » » 

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