News from Semiconductor International

Pressure Builds on Gate-First High-k Problems with the gate-first approach to high-k/metal gate deposition may force IBM to switch to the gate-last approach pioneered by Intel, technologists said at IEDM. GlobalFoundries and other members of the Fishkill Alliance are putting pressure on IBM to reconsider its gate-first approach, which technologists...

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Defect Detection Drives to Greater Depths

Equipment suppliers are scrambling to develop new methods to detect particles that are smaller, visible and non-visible, while maintaining throughput. more » » »  ...

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Researchers Strive for Copper TSV Reliability

from SemiConductor International Moving 3-D TSVs to high-volume manufacturing will require rock-stable TSV reliability. Although copper CTE-related issues have appeared during recent scale-up activities, IMEC and other research centers are beginning to come up with solutions. more » » »  ...

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