Friday, June 26, 2009

Ulvac Rolls PECVD for Tandem PV Cells

TOP STORY... From Semiconductor International. Ulvac Inc. has developed a PECVD system aimed at tandem junction PV cells. The CIM-1400 system adds a microcrystalline silicon layer to amorphous silicon thin-film solar cells, boosting cell conversion efficiency. The tool will be incorporated into a turnkey production line for tandem junction thin-film...

Saturday, June 20, 2009

New trends in Wafer Processing

Thin SOI Devices Shine at VLSI Symposium At the 2009 Symposium on VLSI Technology in Kyoto, Japan, an IBM R&D team described fully depleted CMOS devices created on extremely thin silicon-on-insulator (ETSOI) wafers, aimed at the 22 nm node and beyond. A Hitachi team presented SRAMs fabbed on ultrathin buried oxide SOI. Both avoided ion implantation...

New technologies on Semiconductor Tech

Printed Electronics Seeing Wide Progress Executives from an array of printed electronics companies will describe progress in the field at SEMICON West. Materials, equipment and manufacturing processes for printed electronics are a focus at the show, including a July 16 session on Manufacturing Technology for Commercial Printed and Flexible Electronics. more...

Thursday, June 18, 2009

NEC's MRAM Uses Vertical Magnetic Spin

TOP STORY... from Semiconductor International... NEC presented a spintronics MRAM cell at the Symposium on VLSI Technology in Kyoto, Japan. The cell uses a vertical magnetic structure that may be scalable to sizes smaller than today's SRAM cells. more » » » ...

Tuesday, June 16, 2009

SID: Flexible Displays Are on Their Way

TOP STORY...  from Semoconductor International New displays aimed at E-books and other portable products were at center stage at the Society of Information Displays (SID) conference. Electrophoretic displays used for E-book applications are seeking to move to color, while flexible ultrathin AMOLED displays are adopting a multilayer stack approach...

NEWS FROM THE WORLD OF MATERIALS

Visit the Materials360® Plus and the Materials News pages on the MRS Website for continually updated research news and features Image in Focus         Credit: Adam Jakus, Georgia Institute of TechnologyPollenesian SerenityMultiple species of bare and alumina coated pollen particle images...

Thursday, June 4, 2009

IMEC Changes Leadership, Broadens Scope

TOP STORY... June 3, 2009Luc Van den hove was named CEO at IMEC, taking over the role held by Gilbert Declerck for the past decade. Under Declerck's leadership, IMEC has played a key role in IC R&D while developing technology in new areas such as photovoltaics and biomedical electronics. "Under Gilbert's management, IMEC has grown into an internationally...

Intel Puts Mobile MPUs in Ultrathin Package

Business Wire, 6/2/2009 At Compudex this week, Intel introduced four new processors, "all in a slim, sleek package," said Mooly Eden, vice president and general manager of the Mobile Platforms Group at Intel. More...

Tuesday, June 2, 2009

Entrepix Key to Schiltron's Prototypes

TOP STORY... June 1, 2009Schiltron, a startup with a thin-film transistor 3-D memory architecture, said Entrepix, a CMP technology provider, played a key role in creating prototypes. Entrepix partnered with Schiltron to use CMP in two key process steps of the dual-gate design.  Read more >>...

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