News from Semiconductor International

Pressure Builds on Gate-First High-k Problems with the gate-first approach to high-k/metal gate deposition may force IBM to switch to the gate-last approach pioneered by Intel, technologists said at IEDM. GlobalFoundries and other members of the Fishkill Alliance are putting pressure on IBM to reconsider its gate-first approach, which technologists...

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Defect Detection Drives to Greater Depths

Equipment suppliers are scrambling to develop new methods to detect particles that are smaller, visible and non-visible, while maintaining throughput. more » » »  ...

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Researchers Strive for Copper TSV Reliability

from SemiConductor International Moving 3-D TSVs to high-volume manufacturing will require rock-stable TSV reliability. Although copper CTE-related issues have appeared during recent scale-up activities, IMEC and other research centers are beginning to come up with solutions. more » » »  ...

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Rugged Nano Films to Enable Applications

from Semiconductor International Stronger nanoparticle films that are easier to handle have been developed by Vanderbilt University researchers. "Our films are so resilient that we can pick them up with a pair of tweezers and move them around on a surface without tearing," said James Dickerson, assistant professor of physics at Vanderbilt. more » » »  ...

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IEDM Confronts Logic Scaling Challenges

from Semiconductor International The International Electron Devices Meeting (IEDM), set for Dec. 6-9 in Baltimore, includes presentations on new annealing techniques, finFETs, compound semiconductors and random telegraph noise. The conference, with 215 paper presentations, will be preceded by a Sunday short course on scaling challenges organized by...

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Nikko Metals Offers Hybrid 450 mm Wafers

Nikko Metals, a subsidiary of Nippon Mining and Metals, is readying hybrid 450 mm wafers that sinter a 300 mm single-crystal silicon wafer inside a 450 mm polycrystalline wafer. The goal is to save money for companies developing process equipment targeted to the 450 mm wafer diameter. more » » »  ...

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Nikko Metals Offers Hybrid 450 mm Wafers

from Semiconductor International Nikko Metals, a subsidiary of Nippon Mining and Metals, is readying hybrid 450 mm wafers that sinter a 300 mm single-crystal silicon wafer inside a 450 mm polycrystalline wafer. The goal is to save money for companies developing process equipment targeted to the 450 mm wafer diameter. more » » » ...

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Quantum Dot Mapping Points to Unthought of Applications

from Semiconductor International University of Michigan physicists have mapped quantum dots, crystals with wide-ranging applications in electronics and photovoltaics. The step may lead toward "designer dots" that can be tailored for specific applications, and demonstrates the usefulness of X-ray phasing techniques. more » » » ...

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Virtual Classroom for Members at ASTM

ASTM International is pleased to offer a series of free one-hour online training workshops. For more details on each training session and to register, please click on the appropriate link(s) below. If you need more information or have any questions, please contact Kevin Shanahan Read More >>>...

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Carsem Announces Extremely Thin MLP

from Semiconductor International Carsem, a provider of turnkey packaging and test services, announced an extremely thin version of its Micro Leadframe Package (MLP). more » » » ...

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From Photovoltaics Report

from Semiconductor International Sharp Breaks Record for Triple-Junction Compound Solar Cell By successfully forming a high-crystallinity bottom layer from InGaAs rather than the traditional germanium, Sharp has boosted conversion efficiency to 35.8% for its research-level triple-junction compound solar cell. more » » »  Ascent...

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MEMS Motion Sensors Stay in Motion

from Semiconductor International In the October issue of Semiconductor International, Laurent Robin of Yole Developpement writes that MEMS inertial sensors now represent a $1.85B market. While the majority comes from automotive applications, consumer should overtake automotive by 2012. "When it comes to very high volumes, big IC players are often...

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Solar's Changing Climate: Photovoltaics and the Legislative Effect

from Semiconductor International In this webcast, aired originally on Aug. 27, our global panel of experts -- Winfried Hoffmann of EPIA, Rhone Resch of SEIA and Paula Mints of Navigant Consulting -- explored the evolving legislative environment in key and emerging markets around the world, examining the effects governments are having on the viability...

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From Wefer processing report

News from Semiconductor International IEDM Confronts Logic Scaling Challenges The International Electron Devices Meeting (IEDM), set for Dec. 6-9 in Baltimore, includes presentations on new annealing techniques, finFETs, compound semiconductors and random telegraph noise. The conference, with 215 paper presentations, will be preceded by a Sunday short...

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Perspectives From the Leading Edge: 3-D IC in the City by the Bay

From Semiconductor International At the San Francisco IEEE 3-D conference, MIT's Lincoln Lab reported on their DARPA-sponsored 3-D integration process to combine Si readout circuits with InGaAs photodetectors for short-wavelength infrared (SWIR) imagers. They examined the MOSFET performance before and after integration and found no apparent degradation...

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Dow Unveils CIGS-Based Solar Shingles

from Semiconductor International Dow Chemical Co. unveiled its line of Powerhouse Solar Shingles, integrating thin-film CIGS solar cells with standard asphalt single materials for rooftop applications. more » » » ...

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News from Semiconductor International

Intel Ramping 32 nm Manufacturing in Oregon Intel is shipping "large numbers" of 32 nm samples of its Westmere processor to PC vendors for system testing, said Intel Senior Fellow Mark Bohr. "The 32 nm process is certified, and we are loading up our first factory in support of planned Q4 revenue production," he said.more » » »  Samsung...

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