Rugged Nano Films to Enable Applications

from Semiconductor International

Stronger nanoparticle films that are easier to handle have been developed by Vanderbilt University researchers. "Our films are so resilient that we can pick them up with a pair of tweezers and move them around on a surface without tearing," said James Dickerson, assistant professor of physics at Vanderbilt. more » » »  

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IEDM Confronts Logic Scaling Challenges

from Semiconductor International

The International Electron Devices Meeting (IEDM), set for Dec. 6-9 in Baltimore, includes presentations on new annealing techniques, finFETs, compound semiconductors and random telegraph noise. The conference, with 215 paper presentations, will be preceded by a Sunday short course on scaling challenges organized by TSMC's Howard C.H. Wang. more » » »  

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Nikko Metals Offers Hybrid 450 mm Wafers

Nikko Metals, a subsidiary of Nippon Mining and Metals, is readying hybrid 450 mm wafers that sinter a 300 mm single-crystal silicon wafer inside a 450 mm polycrystalline wafer. The goal is to save money for companies developing process equipment targeted to the 450 mm wafer diameter. more » » »  

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Nikko Metals Offers Hybrid 450 mm Wafers

from Semiconductor International

Nikko Metals, a subsidiary of Nippon Mining and Metals, is readying hybrid 450 mm wafers that sinter a 300 mm single-crystal silicon wafer inside a 450 mm polycrystalline wafer. The goal is to save money for companies developing process equipment targeted to the 450 mm wafer diameter. more » » » 

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Quantum Dot Mapping Points to Unthought of Applications

from Semiconductor International

University of Michigan physicists have mapped quantum dots, crystals with wide-ranging applications in electronics and photovoltaics. The step may lead toward "designer dots" that can be tailored for specific applications, and demonstrates the usefulness of X-ray phasing techniques. more » » » 

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Virtual Classroom for Members at ASTM

ASTM International is pleased to offer a series of free one-hour online training workshops. For more details on each training session and to register, please click on the appropriate link(s) below. If you need more information or have any questions, please contact Kevin Shanahan

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Carsem Announces Extremely Thin MLP

from Semiconductor International

Carsem, a provider of turnkey packaging and test services, announced an extremely thin version of its Micro Leadframe Package (MLP). more » » » 

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